Machinable Aluminium Nitride

We have recently started to offer our Customers an alternative to BNP-2 and Shapal Hi M Soft material which is far more cost effective but with very similar properties.

This new material we are now offering is ABN2000 and  below you will find the material data sheets for all three materials so you can see the comparison.

BNP-2 has low expansion compared to Shapal and ABN2000 , however, both materials BNP-2 and ABN2000 are designed to copy Shapal M but at a far cheaper cost.

We can offer a small free of charge sample of ABN2000 for our Customers to test and evaluate and we are happy to quote Customers the different materials so they can see the savings that can be made should ABN2000 be suitable for their application.

ABN2000

General Properties

Grade                                                Boron Nitride/Aluminium Nitride

Colour                                               Grey

Typical Applications                      Extreme high thermal conductivity and flexural strength

Mechanical Properties

Flexural Strength @25°c (MPa)                                      250

Young Modulus (GPa)                                                       34.1 – 75.2

Compressive Strength (MPa)                                          1070

Fracture Toughness (MPa M1/2)                                   2.5 – 3

Density (g/cm3)                                                                  2.85

Hardness (KG/mm2)                                                         342

Thermal Properties

Thermal Conductivity @25°c (W/mK)                          85

Coefficient Thermal Expansion 25-1200°c                  2.5-3 (10¯⁶K)

Max Temperature °c (Oxidising)                                    900

Max Temperature °c (Vacuum)                                      1800

Electrical Properties

Dielectric Constant @ 1 MHz                                          7.1

Dissipation Factor @ 1 MHz                                            N/A

Dielectric Strength (kV/mm)                                           40

RT Resistivity (Ohm cm)                                                   N/A

BNP-2

Physical Properties (Typical Data)

Property                                           Test Conditions                           BNP-2                   Units

 General

Density                                                   Corrected to 4°C                                  2.90                        g/cm3

Poristy                                                    25°C                                                        <0.1                        %

ELECTRICAL

Volume Resistivity                               25°C, DC                                                 1.0×10¹²                         Ω cm

Dielectric Constant (ε)                        25°C 1MHz                                            7.1

Dielectric Strength                               25°C, sample thickness 1mm, AC     40                           kV/mm

THERMAL

Thermal Conductivity                          25°C                                                        92.6                        W/m • K

Maximum Use Temp                           In Air                                                      1020                       °C

In non oxidizing atmosphere             1900                       °C

Thermal Stock  Resistance ∆T            Water Quench                                     400                         °C

Thermal Expansion                              400-600°C                                             4.5×10^-6                         

MECHANICAL

Bending Strength                                 25°C                                                        300                         MPa

Compressive Strength                         25°C                                                        1170                       MPa

PURITY

Ca           450ppm

Cr            60ppm

Mg         <20ppm

Ni            <10ppm

Fe           <50ppm

Si             <15ppm

O             0.8%

SHAPAL™ Hi-M SOFT

MACHINABLE ALUMINIUM NITRIDE CERAMIC

SHAPAL™Hi-M soft is a machinable grade of Aluminium Nitride and combines a high thermal conductivity with a high mechanical strength with bending strengths of 30 Kg/m.

Properties:

• Shapal-M can be machined into complex shapes with high precision
• High thermal conductivity, five times more than alumina
• High mechanical strength, has a flexural strength of 30kg/mm2 which is comparable to that of alumina.
• Excellent electrical insulation
• Low thermal expansion
• Low dielectric loss
• Good high temperature ability
• Excellent sealing ability under vacuum

Applications:

• Vacuum Parts
• Electronic parts where high thermal conductivity is required
• Heat sinks
• Crucibles for vacuum deposition
• Refractory parts such as protective tubes
• A comprehensive range of industrial applications

Physical properties (@25°C)

Porosity                                 0%

Volume Resistivity               1.0 x 10¹⁵ Ωcm

Dielectric Constant              6.8

Dielectric Strength               65 kv/mm

Thermal Conductivity          92 W/m°C

Thermal Expansion              RT to 400°C           – 4.8 X10^-6

                                                            RT to 600°C           – 4.9 X 10^-6

                                                            RT to 800°C           – 5.0 X 10^-6

Maximum Use Temp           1000°C (air)

1900°C (in inert atmosphere)

Bending strength                 300 Mpa

Compressive strength         100 Kg/mm²

Modulus of Elasticity           1.8 x 10⁴ Kg/mm²

Poisson’s Ratio                     0.31

Vickers Hardness                 380 kg/mm²